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Releases: zzattack/xbox-cpu-interposer

v3.3

14 Aug 15:17
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Revision 3.3

Minor improvements over 3.2:

  • Resistor network RN01 changed to 4 distinct 0603's since people continuously order an incorrect part
  • Height of interposer slightly reduced by 0.3mm on both top and bottom. on top, the pins for standard mounting bracket require less trimming. On bottom there is less obstruction with C1D5 on xbox motherboard.
  • Added xbox.munia.io branding on the bottom silk
  • Align tool modified accordingly.

Ordering information

PCB specifications:

  • 6 layer, 49.5x48.6mm
  • Board thickness: 1.6mm
  • Min track size: 5 mil
  • Min clearance: 5 mil
  • Min drill/via size: 0.3mm / 0.4mm
  • Board-to-edge clearance: 0.2mm

These specifications can be used to take advantage of the JLCPCB promotional $2 offer for 5 pieces of 6-layer boards.

rev33
rev33_front
rev33_back

Aligntool

Helpful board to determine positioning of actual interposer.
Can be ordered using cheapest specifications, preferably in 1.0mm thickness.
aligntool

v3.2

07 Jan 17:12
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Revision 3.2; fixes over revision 3 that should now result in a functional board.

Ordering information:

6 layer, 49.5x49.2mm
Board thickness: 1.6mm
Min track size: 5 mil
Min clearance: 5 mil
Min drill/via size: 0.3mm / 0.4mm
Board-to-edge clearance: 0.2mm

rev32
rev32_front
rev32_back

Aligntool

Helpful board to determine positioning of actual interposer.
Can be ordered using cheapest specifications.
aligntool
ard

v3

01 Dec 23:58
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v3

Revision 3; rerouted while making use of via-in-pad and tighter drills for a much cleaner layout.

Important: design problems.

If you had this design fabricated, then please disconnect uBGA495 trace P1 and leave PGA370 pins AL1, AK36, AJ3 and AF36 floating.
Alternatively, order latest revision instead.

Ordering information:

6 layer, 48x48mm
Board thickness: 1.2mm
Min track size: 4 mil
Min clearance: 4 mil
Min drill/via size: 0.2mm / 0.3mm
Board-to-edge clearance: 0.2mm

rev3
rev3_front
rev3_back

v2.1

29 Nov 10:59
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Revision 2, rerouted with BGA footprint relocated and tighter design specifications.

DO NOT ORDER - Use latest revision instead; faults were found.

  • 6 layer, 50x50mm
  • Board thickness: 1.2mm
  • Min track size: 5 mil
  • Min clearance: 5 mil
  • Min drill/via size: 0.3mm / 0.4mm
  • Board-to-edge clearance: 0.2mm

This allows to take advance of the JLCPCB promotion offer of $2 for 5 boards.

cad
interposer_rev2 1_front
interposer_rev2 1_back

v2.0

28 Nov 22:13
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Revision 2, rerouted with BGA footprint relocated and tighter design specifications.

Ordering information:

  • 6 layer, 50x50mm
  • Board thickness: 1.2mm
  • Min track size: 5 mil
  • Min clearance: 5 mil
  • Min drill/via size: 0.3mm / 0.4mm
  • Board-to-edge clearance: 0.2mm

This allows to take advance of the JLCPCB promotion offer of $2 for 5 boards.

rev2_front
rev2_back
cad

v1.0

26 Nov 00:54
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Ordering information Use latest revision; faults were found.

PCB specifications:

  • 6 layer, 50x50mm
  • Board thickness: 1.2mm
  • Min track size: 5 mil
  • Min clearance: 5 mil
  • Min drill/via size: 0.25mm / 0.35mm
  • Board-to-edge clearance: 0.2mm

Renders

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kicad_KJvHW11A6o