update for new binned memories and first split-fpga chain #57
Conversation
This file contains bidirectional Unicode text that may be interpreted or compiled differently than what appears below. To review, open the file in an editor that reveals hidden Unicode characters.
Learn more about bidirectional Unicode characters
aehart
reviewed
Feb 13, 2024
aehart
reviewed
Feb 13, 2024
aehart
reviewed
Feb 13, 2024
aehart
reviewed
Feb 13, 2024
aehart
reviewed
Feb 13, 2024
aehart
reviewed
Feb 13, 2024
aehart
reviewed
Feb 13, 2024
aehart
reviewed
Feb 13, 2024
aehart
reviewed
Feb 13, 2024
aehart
reviewed
Feb 13, 2024
aehart
reviewed
Feb 13, 2024
aehart
reviewed
Feb 13, 2024
aehart
reviewed
Feb 13, 2024
aehart
reviewed
Feb 13, 2024
aehart
approved these changes
Feb 22, 2024
Merged
Sign up for free
to join this conversation on GitHub.
Already have an account?
Sign in to comment
Add this suggestion to a batch that can be applied as a single commit.
This suggestion is invalid because no changes were made to the code.
Suggestions cannot be applied while the pull request is closed.
Suggestions cannot be applied while viewing a subset of changes.
Only one suggestion per line can be applied in a batch.
Add this suggestion to a batch that can be applied as a single commit.
Applying suggestions on deleted lines is not supported.
You must change the existing code in this line in order to create a valid suggestion.
Outdated suggestions cannot be applied.
This suggestion has been applied or marked resolved.
Suggestions cannot be applied from pending reviews.
Suggestions cannot be applied on multi-line comments.
Suggestions cannot be applied while the pull request is queued to merge.
Suggestion cannot be applied right now. Please check back later.
PR (corresponding with firmware_hls 315 adds capability to handle new binned memory module. An additional flag is added to generator_hdl.py to enable the creation of a first half split-fpga chain. This chain is from IR to TP, and excludes the VMSME and TPROJ memories that will instead be calculated on the second device.