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.../JY_FENG/Semiconductor Physics and Devices/1 The Crystal Structure of Solids.md
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# 1 The Crystal Structure of Solids | ||
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## 1.0 Preview | ||
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In this chapter, we will: | ||
■ Describe three classifications of solids—amorphous 非晶体, polycrystalline 多晶体, and single crystal. | ||
■ Discuss the concept of a unit cell. | ||
■ Describe three simple crystal structures and determine the volume and surfacedensity of atoms in each structure. | ||
■ Describe the diamond crystal structure. | ||
■ Briefly discuss several methods of forming single-crystal semiconductor materials. | ||
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## 1.3 Space Lattices | ||
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*lattice point* 晶格点 | ||
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*unit cell* a small volume of the crystal that can be used to reproduce the entire crystal | ||
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*primitive cell* the smallest unit cell that can be repeated to form the lattice. | ||
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### 1.3.2 Basic Crystal Structures | ||
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#### Volume Density of Atoms | ||
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1.5 (b) | ||
$$ | ||
\frac1{8}\times8+1=2\\ | ||
Volume\space Density=\frac{\#atoms\space per\space unit\space cell}{volume\space of \space unit\space cell}={2\over a^3} | ||
$$ | ||
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#### Three lattice types: | ||
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![image-20240404233603766](./assets/image-20240404233603766.png) | ||
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(a) simple cubic, (b) body-centered cubic, (c) face-centered cubic. | ||
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### 1.3.3 Crystal Planes and Miller Indices | ||
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surface matters a lot | ||
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the intercepts of the plane 平面的截距 | ||
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#### Miller indices | ||
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hkl plane | ||
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![image-20240404234517741](./assets/image-20240404234517741.png) | ||
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取截距倒数?the use of infinity is avoided | ||
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take the reciprocal(倒数) of the intercepts(截距) | ||
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distance between nearest equivalent parallel planes | ||
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surface concentration | ||
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#### surface density | ||
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![image-20240404235422381](./assets/image-20240404235422381.png) | ||
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### 1.3.4 Directions in Crystals | ||
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[1,1,1]平面法向量 | ||
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## 1.4 The Diamond Structure | ||
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tetrahedral 四面体 | ||
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![image-20240404235735774](./assets/image-20240404235735774.png) | ||
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![image-20240404235924203](./assets/image-20240404235924203.png) | ||
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#### zincblende (sphalerite) structure | ||
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![image-20240405000105070](./assets/image-20240405000105070.png) | ||
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## 1.5 Atomic Bonding | ||
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qualitative understanding | ||
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valence electrons 价电子 | ||
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ions 离子 | ||
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coulomb attraction 库伦吸引 | ||
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#### ionic bond 离子键 | ||
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NaCl | ||
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#### covalent bonding 共价键 | ||
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H~2~ | ||
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the outer silicon atoms always have valence electrons available for additional covalent bonding - infinite structure | ||
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#### metallic bonding 金属键 | ||
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#### Van der Waals bond 范德华~ | ||
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nonsymmetry - small electric dipole - interact with each other | ||
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## 1.6 imperfections and impurities in solids | ||
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electrical parameters | ||
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### 1.6.1 imperfections in solids | ||
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atomic thermal vibration | ||
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##### lattice vibration | ||
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thermal energy(function of temperature) - atom randomly fluctuate | ||
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##### point defect | ||
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lack of an atom - **vacancy** | ||
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<img src="./assets/image-20240410102423914.png" alt="image-20240410102423914" style="zoom:33%;" /> | ||
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多了一个 **interstitial** | ||
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* **Frenkel defect** | ||
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##### line dislocation | ||
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### 1.6.2 impurities in Solids | ||
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##### lattice defects | ||
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*substitutional* impurities | ||
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*interstital* impurities | ||
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![image-20240410103330800](./assets/image-20240410103330800.png) | ||
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##### doping (参杂原子) | ||
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* impurity diffusion | ||
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high temperature - vacancy - impurity partical move from high concentration to lower - low down the temp | ||
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* ion implantation | ||
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low temp - ions be accelerated | ||
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defect: lattice displacement damage | ||
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solve: thermal anneal 热退火 | ||
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## 1.7 growth of semiconductor materials | ||
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### 1.7.1 growth from a melt | ||
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#### Czochralski Method(Growth) | ||
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seed - the same material in liquid phase - pulled - bigger | ||
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#### zone refining(Purify) | ||
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At the solid–liquidinterface, there is a distribution of impurities between the two phases. The parameter that describes this distribution is called the **segregation coefficient**: the ratio of the | ||
concentration of impurities in the solid to the concentration in the liquid. | ||
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r-f coil 射频线圈 | ||
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#### 切割 | ||
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flat(110)plane | ||
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#### polish | ||
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chemecal etch | ||
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### 1.7.2 Epitaxial Growth | ||
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外延生长 | ||
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single-crystal substrate | ||
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*homoepitaxy* one material | ||
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*heteroepitaxy* e.g. Growing epitaxial layers of the ternary alloy AlGaAs on a GaAs substrate | ||
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#### CVD chemical vapor-phase deposition | ||
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chemical reaction release material atom to deposit on the material | ||
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#### Liquid-phase epitaxy | ||
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melt temp lower than the semiconductor itself | ||
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practiced at low temp (III-V) | ||
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#### Molecular Beam Epitaxy | ||
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vacuum iat temp 0f 400-800 | ||
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semiconductor and dopant atoms evaporated onto the surface of the substrate | ||
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## 1.8 Summary | ||
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**substrate** A semiconductor wafer or other material used as the starting material for further semiconductor processing, such as epitaxial growth or diffusion. | ||
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**ternary semiconductor** A three-element compound semiconductor, such as aluminum gallium arsenide (AlGaAs). | ||
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**elemental semiconductor** A semiconductor composed of a single species of atom, such as silicon or germanium. | ||
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