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-Subproject commit 3332b46ddfb77274ba49bbffe61f80dd56ea4707
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 # Lessons
 lessons:
-  - title: Lessons learnt
-    subtitle: Good practices to continue for future projects
-    list:
-      - name: Add functional logical blocks in schematic to use similar circuits in future versions or other projects
-      - name: Use stencil SMD soldering with SMD components only if it is necessary. Else, use a PCB assembly service.
-      - name: Use minimum number of through-hole components
-      - name: Check Gerber file format with the PCB manufacturer before rendering them
-      - name: Check <code>F.Paste</code> and <code>B.Paste</code> layers for SMD stencil pattern
-      - name: Pull out every single MCU pin as a test point for the first version of the project.
-      - name: Always buy buffer number of components. Image is from the book Designing Electronics That Work by Hunter Scott.
-        image: buffer-components.png
-
-  - title: Enclosure
-    subtitle: Next iteration improvements
-    list:
-      - name: Make the PCB routing symmetrical for LED positions and connector slots
-      - name: Ensure the length is not too long to prevent bending of the material
-      - name: Use wider ventilation holes with wider spacing between each of them
-      - name: Use less clearance for connector slots. Take note of finger access
-      - name: Use other shapes for connector slots E.g. rounded corner or trapezoid
-      - name: Use shape binder for seperation plane bends
-      - name: Use a counter sunk screw head
-      - name: Make the screw lug's initial length be wider to contain the screw head so that it can sink into the surface
-      - name: Try a snap-fit enclosure
-
-  - title: V2.0
-    subtitle: For next iteration
-    list:
-      - name: Use SMD components only on top layer for one-step manual SMD stencil soldering process
-      - name: Place a writable area on the silkscreen to note down LoRa node address, PCB number, frequency or other info
-      - name: Add a <a href="https://sg.element14.com/c/test-measurement/test-connectors-ic-clips/pcb-test-points?connector-mounting=surface-mount">surface mount PCB test point</a> for <code>VBAT</code>, <code>VBUS</code>, <code>3.3V</code>, <code>5V</code>, <code>GND</code> and SPI points.
-      - name: Use a smaller <code>SSD1306</code> I2C OLED display instead of E-Ink. It's cheaper and easier to source and buy.
-
-  - title: Board bring-up
-    list:
-      - name: Check with 3 PCBs to conclude whether it is a design issue or a soldering / manufacturing / assembly issue
-      - name: Power it with current limiting power supply unit only. Check all the power test points such as <code>VBAT</code>, <code>VBUS</code>, <code>3.3V</code>, <code>5V</code>, <code>GND</code>.
+  - name: (Schematci) Add functional logical blocks in schematic to use similar circuits in future versions or other projects
+  - name: (Manufacturing) Use stencil SMD soldering with SMD components only if it is necessary. Else, use a PCB assembly service.
+  - name: (Manufacturin) Use minimum number of through-hole components
+  - name: (Manufacturing) Check Gerber file format with the PCB manufacturer before rendering them
+  - name: (Manufacturing) Check <code>F.Paste</code> and <code>B.Paste</code> layers for SMD stencil pattern
+  - name: (Testing) Pull out every single MCU pin as a test point for the first version of the project.
+  - name: (BOM) Always buy buffer number of components. Image is from the book Designing Electronics That Work by Hunter Scott.
+    image: buffer-components.png
+  - name: (Layout) Make the PCB routing symmetrical for LED positions and connector slots
+  - name: (Case) Ensure the length is not too long to prevent bending of the material
+  - name: (Case) Use wider ventilation holes with wider spacing between each of them
+  - name: (Case) Use less clearance for connector slots. Take note of finger access
+  - name: (Case) Use other shapes for connector slots E.g. rounded corner or trapezoid
+  - name: (Case) Use shape binder for seperation plane bends
+  - name: (Case) Use a counter sunk screw head
+  - name: (Case) Make the screw lug's initial length be wider to contain the screw head so that it can sink into the surface
+  - name: (Case) Try a snap-fit enclosure
+  - name: (Manufacturing) Use SMD components only on top layer for one-step manual SMD stencil soldering process
+  - name: (Layout) Place a writable area on the silkscreen to note down LoRa node address, PCB number, frequency or other info
+  - name: (Layout) Add a <a href="https://sg.element14.com/c/test-measurement/test-connectors-ic-clips/pcb-test-points?connector-mounting=surface-mount">surface mount PCB test point</a> for <code>VBAT</code>, <code>VBUS</code>, <code>3.3V</code>, <code>5V</code>, <code>GND</code> and SPI points.
+  - name: (BOM) Use a smaller <code>SSD1306</code> I2C OLED display instead of E-Ink. It's cheaper and easier to source and buy.
+  - name: (Testing) Check with 3 PCBs to conclude whether it is a design issue or a soldering / manufacturing / assembly issue
+  - name: (Testing) Power it with current limiting power supply unit only. Check all the power test points such as <code>VBAT</code>, <code>VBUS</code>, <code>3.3V</code>, <code>5V</code>, <code>GND</code>.
 
 # Schedule
 design_start: '2019-11-05'