You signed in with another tab or window. Reload to refresh your session.You signed out in another tab or window. Reload to refresh your session.You switched accounts on another tab or window. Reload to refresh your session.Dismiss alert
Hey - thanks for catching that - that appears to be an error on the V0.8 hotswap variants (V0.8DHA and V0.8JHA). I'll make revisions V0.8.1DHA and V0.8.1JHA that remove that patch. It does pose a shorting risk where +3.3V could easily short to ground.
On V0.6.1D (and on V0.8D and V0.8J) that spot is where a bunch of vias surface and is for hand-soldering the pad underneath the QFN STM32F072's (-CBU6 and -CBU7), but the MCU moved for the hotswap variants but I forgot to delete the solder mask exclusion
Also - when I have time in a couple of weeks I'll prepare JLCPCB files for the V0.8 lineup, which should be cheaper than Elecrow in small quantities.
Is there supposed to be exposed copper underneath f11? I tried ordering and elecrow asked about this section.
The text was updated successfully, but these errors were encountered: